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along the length of the furnace and the conveyor speed determine the time-temperature profile More zones (five to seven are typical) provide for better control of the soldering profile Inert atmospheres, typically nitrogen (N2) to minimize cost, can be maintained to better than 20 ppm oxygen (O2) However, control of both the time-temperature profile as well as atmosphere cannot match that of a batch furnace Also, vacuum conditions are not possible with most inline equipment Nevertheless, inline furnaces are well suited for high production volumes and are the most widely used furnace type for electronics assembly Whether batch or inline, furnace selection is based not only on throughput rates, but is also determined by the type of product being assembled A greater complexity to the circuit board requires more control of the time-temperature profile to ensure that all of the solder joints are completed at minimum defect levels.

In some applications, the extra furnace zones are used to control the cooling rate of the soldered circuit board to prevent thermal shock damage to sensitive components or substrates The introduction of Pb-free solders has impacted reflow soldering, less so in terms of actual equipment temperature capabilities than in the development of a suitable time-temperature profile The heat source technology (infrared, convection, or mixed) can provide the higher reflow temperatures of the Sn-Ag-XCu alloys (Tmelt = 217 C versus 183 C for the traditional Sn-Pb solder) Of course, higher energy usage and maintenance costs are likely Two generalized reflow profiles are used for Pb-free soldering They are illustrated graphically in Fig 4023 The soak-reflow profile in Fig 4023a derives from the traditional Sn-Pb eutectic solder profile, but with the reflow spike increased for the higher melting Sn-Ag-Cu alloys.

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The soak step provides for activation of the flux as well as heatup of the circuit board and components The continuous ramp or hat profile in Fig 4023b allows for a more rapid heatup rate, which reduces the time that heat-sensitive components and materials spend at elevated temperatures On the other hand, the relatively faster heatup rate can increase the chances of thermal shock damage to some components for example, larger plastic and ceramic devices or to circuit board structures such as vias..

12 V and can be used to provide -ve voltage to the circuit. 2. DTR: Data Terminal Ready. Output signal used for communicating with a modem. This can be used to provide either 12 or 12 V supply. However, when the signal is loaded, the voltage drops. Usually, a micropower regulator or even a zener diode can be used to get a lower supply voltage for the AVR processor. 3. RTS: Request to Send. Output control signal used for communicating with an external device. Can be used in a fashion similar to the DTR signal. The DTR and the RTS signals are controlled by the Modem Control Register (MCR) in a PC. The MCR is at an address offset 4 from the RS-232 base address. By writing $01 to the MCR, the DTR is set to 12 V and by writing $02, the RTS is set to 12 V while writ, ing $03 to the MCR, both the RTS and the DTR are set to 12. Table 5.1 illustrates all the combinations of voltages that you can get on the DTR and the RTS signal pins by writing the appropriate control word to the MCR. The following C code (rspower.c) shows how to put both the DTR and the RTS signal to 12 V .

(11) is read from the vertical axis from the intersection of the supply pressure of 75 lbf / in2 and the curve

FIGURE 40.23 Generalized time-temperature profiles for Pb-free reflow soldering: (a) the soak-reflow profile; (b) the continuous ramp or hat profile. Peak temperatures will vary, depending on the particular circuit board product.

In terms of optimizing the time-temperature profile, a balance must be established between achieving sufficiently high temperatures that will reflow the solder of every component (size and shape) and preventing thermal damage to other components or the substrate. Therefore, the higher melting temperatures of Pb-free solders make it more challenging to develop a time-temperature profile that will successfully melt the solder paste of larger components without causing thermal damage to smaller devices or to the circuit board material.

Therefore, in the case of some very-high-mix products, it may be necessary to solder larger packages in a separate operation (eg, hand soldering or selective soldering) Under this circumstance, the latter packages would be considered as odd-form components 40335 Wave Soldering Wave soldering is used when surface-mount technology is mixed with through-hole components on the circuit board (See Figs 407 409 showing wave soldering as it is used for through-hole circuit boards) Surface-mount devices that are present on the same side as the wave are soldered as well, being held in place by an adhesive The surface-mount components must be resistant to thermal shock because of the temperature spike experienced upon entering and leaving the molten solder wave.

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