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The temperature on the topside surface of the circuit board typically remains well below the solder solidus temperature, thereby preventing the reflow of any solder joints present there Wave-soldering equipment can be used either in an inline or in a batch process since the equipment has generally the same construction The inline approach is used to support high production volumes Small systems that are used in a batch-like mode include those used for selective soldering This equipment includes miniwaves or solder fountains and are used to solder only localized areas of the circuit board, such as when attaching through-hole connectors, transformers, or switches The advantage of selective (wave) soldering is that the entire circuit board need not be exposed to an elevated temperature An important consideration in wave soldering is the supporting fixtures that hold the circuit board on of the conveyor.

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In reflow soldering, the conveyor can support the entire bottom side of the circuit board However, in wave soldering, the conveyor does not offer such support, as it must allow the wave to contact the circuit board bottom side Therefore, it may be necessary to provide an additional fixture to prevent warpage and sagging of larger circuit boards The impact of Pb-free technology on wave soldering has largely occurred in the equipment performance It has been determined that the same solder bath temperatures that are used for Sn-Pb processes (250 to 270 C) are suitable for the Sn-Ag-XCu Pb-free alloys Therefore, excessive dross formation and flux residue removal have not become a significant problem during equipment operation The lack of shiny fillets with the Sn-Ag-XCu alloys has been addressed by modified alloys having Ni and Ge additions that alter the solidification process, which leads to shinier fillet surfaces.

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The Pb-free alloy compositions are more prone to erode the wave machine s structures, such as the impeller, baffles, and pot walls New wave-soldering machines address this problem through the use of alternative steel alloys and ceramic coatings 40336 Condensation (Vapor Phase) Soldering Condensation soldering, also referred to a vapor phase soldering, uses a working fluid s heat of condensation to reflow the solder paste or solder preform to make the joints Because the condensation reflow process had its origins in the early days of surface-mount technology when production runs were more limited in volume, these machines were primarily batch-type units Subsequently, inline equipment was developed to attach the vapor phase reflow machine to the back end of the placement equipment for higher production volumes.

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Two particular attributes of condensation soldering are (a) the temperature of the product cannot exceed the vaporization (or condensation) temperature of the working fluid, thereby preventing overheating of temperature-sensitive materials; and (b) the temperature is very uniform over all of the components and the substrate, thereby minimizing temperature gradients that could warp or crack component or laminate materials This process fell out of favor in the early 1990s, for two reasons First, the working fluid for Sn-Pb solder, Dupont s Freon TMF, was categorized as an ozone-depleting substance (ODS) Its use was initially restricted and then prohibited by the Montreal Protocols Second, the increasingly more complex circuit boards that were being designed with surface-mount technology required more precise control of the time-temperature profile, which lead to the development of multizone reflow furnaces having convective and infrared heating capabilities There has been a resurgence in the use of condensation soldering.

Alternative working fluids have been developed for both Sn-Pb and Pb-free processing that are compatible with.

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environmental regulations Preheaters are added to reduce the thermal shock when parts entered the working fluid, thereby providing a more controlled time-temperature profile Lower capital cost and properties of the condensation heat source previously noted cause condensation or vapor phase reflow to be well suited for prototype development programs and small production volumes 40337 Hand Soldering As noted earlier, in the highly automated surface-mount assembly line having automated paste printing and component placement capabilities, hand soldering would not be particularly advantageous in terms of maximizing production volumes However, in some applications, the assembly process includes a hand-soldering operation For example, often odd-form components cannot be incorporated in a pick-and-place machine, or temperature-sensitive devices cannot be exposed to the reflow furnace environment Under these circumstances, the hand-soldering step is performed after mass soldering (reflow, wave, etc).

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