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In the United States, CEM-1 material, which is a composite of paper and glass impregnated with epoxy resin, is the most popular substrate for SSBs While not as low cost as XPC-FR or FR-2, CEM-1 has gained popularity because of its mechanical strength and also because of the relative unavailability of paper phenolic laminates 5612 Single-Sided Board Fabrication Process Given the emphasis on cost and low complexity, SSBs are generally produced in highly automated, conveyorized print-and-etch lines, using the following basic process flow Step 1: Step 2: Step 3: Step 4: Step 5: Step 6: Step 7: Step 8: Step 9: Step 10: Step 11: Cut substrate into appropriate panel size by either sawing or shearing Place panel in loader which feeds them into the line Clean panels Screen panel with ultraviolet curable etch-resist ink Cure the etch-resist ink Etch exposed copper Strip the resist.

Feed hole diameter d* (in 10 3)

Apply solder resist Screen legend Form holes by drilling or punching Test for shorts and opens..

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The conveyor speed of automated print-and-etch lines ranges from 30 to 45 ft/min. Some lines are equipped with an online optical inspection which enables the elimination of the final electrical open/short test. As previously noted, after the conductor pattern is generated in the print-and-etch line, holes for component insertion are formed on the panel by punching when the panel is made of paperbased substrate, but must be formed by drilling when the panel is made of glass-based substrate. 5.6.1.3 Process Variations. In some variations, the conductor surface of the PWB gets insulated, exposing only pads, and then conductive paste is screened to form additional conductors on the same side of the board, thus forming double conductive layers on a single side. Most metal-core PWB consumer applications are made of aluminum substrate, which comes as a copper-clad material. PWBs made of such material do not have through-holes, and components are usually surface-mount types. These circuits are frequently formed into threedimensional shapes.

Another source of power that is available most often if you are using a PC together with your application is the PC port signal lines, such as the parallel port and the serial RC232 port. If the PC is equipped with a USB port, it can be used to provide 5 V that is available on a USB connector. I have used the RS-232 signal power in many low-power applications. The RS-232 signals can provide up to 10 mA each. The output signals of the RS-232 port that can be used to provide supply voltage are:

Double-Sided Boards By definition, double-sided boards (DBs) have circuitry on both sides of the boards They can be classified into two categories: 1 Without through-hole metallization 2 With through-hole metallization The category of through-hole metallization can be further broken into two types: 1 Plated-through-hole (PTH) 2 Silver-through-hole (STH) 5621 Plated-Through-Hole Technology PTH technology is discussed in some detail in Sec 57; however, some comments are appropriate here Metallization of holes by copper plating has been practiced since the mid-1950s Since PWB substrate is an insulating material, and therefore nonconductive, holes must be metallized first before subsequent copper plating can take place The usual metallization procedure is to catalyze the holes with palladium catalyst followed by electroless copper plating Then, thicker plating is done by galvanic plating Alternately, electroless plating can be used to plate all the way to the desired thickness, which is called additive plating.

The biggest change in the manufacturing process of double-sided PTH boards, and also of multilayer boards (MLBs), is the use of direct metallization technologies (See Chap 30 for full discussion of electroless and direct metallization for through-hole boards) Here, simply, it eliminates the electroless copper process The hole wall is made conductive by palladium catalyst, carbon, or polymer conductive film, then copper is deposited by galvanic plating The elimination of electroless copper, in turn, allows the elimination of environmentally hazardous chemicals, such as formaldehyde, and EDTA, which are two main components of electroless copper-plating solutions 5622 Silver-Through-Hole Technology STH boards are usually made of paper phenolic materials or composite epoxy paper and glass materials, such as CE-1 or CE-3 After doublesided copper-clad materials are etched to form conductor patterns on both sides of the panel, holes are formed by drilling.

Fig 745: Jet diameter versus clearance for simple orifices [3]

Then the panel is screened with silver-filled conductive paste Instead of silver, copper paste can also be used Since STHs have a relatively high electrical resistance compared with PTHs, the application of STH boards is limited However, because of their economic advantage (the cost of.

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